IEEE transactions on components and packaging technologies : a publication of the IEEE Components, Packaging, and Manufacturing Technology Society
Finna-arvio
IEEE transactions on components and packaging technologies : a publication of the IEEE Components, Packaging, and Manufacturing Technology Society
Tallennettuna:
Genre | |
---|---|
Muut nimekkeet |
Transactions on components and packaging technologies Components and packaging technologies Institute of Electrical and Electronics Engineers transactions on components and packaging technologies Components and packaging technologies, IEEE transactions on |
Kieli |
englanti |
Huomautukset |
Refereed/Peer-reviewed Title from IEEExplore homepage (viewed June 23, 2000). |
Julkaisija |
New York, NY :
Institute of Electrical and Electronics Engineers,
©1999-2010.
|
Luokitus | |
Dewey-luokitus |
621.3 |
Aiheet | |
Muu ilmiasu |
1521-3331 |
Edeltäjä |
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A |
Yhdistynyt julkaisuun |
IEEE Transactions on Advanced Packaging IEEE Transactions on Electronics Packaging Manufacturing IEEE Transactions on Components, Packaging and Manufacturing Technology |
Julkaistu |
Vol. 22, no. 1 (Mar. 1999)-v. 33, no. 4 (Dec. 2010) |
Julkaisutiheys |
Quarterly |
ISSN |
1557-9972 |
Liittyvät tietueet |
Merged with: IEEE transactions on advanced packaging, and: IEEE transactions on electronics packaging manufacturing, to form: IEEE transactions on components, packaging, and manufacturing technology. |
Hankintapaikka |
IEEE Service Center, 445 Hoes Lane, Piscataway, NJ 08854 |
Hae kokoteksti |